SANPLA Low Expansion Grade
Minimal shrinkage and expansion! Resin extrusions with excellent dimensional stability and heat resistance.
"SANPLA Low Thermal Expansion Grade" is a resin extruded product with a low linear expansion rate. The linear expansion coefficient is 3.1, compared to 6-8 for general PVC, which is close to that of aluminum at 2.4, giving it similar characteristics. Even when combining aluminum profiles and resin extrusions, the differences in length due to temperature changes are eliminated. We look forward to your inquiries, quotes, and other consultations regarding our products. 【Features】 ■ Heat resistance + dimensional stability ■ Dimensional stability against temperature changes ■ Prevention of deformation and deflection due to improved heat resistance ■ Achieves a linear expansion coefficient of 3.1 *For more details, please refer to the PDF document or feel free to contact us.
- Company：SANPLA P3
- Price：Other
